IT Industry Silicon Wafer Cleaning With Good Degreasing Performance

IT Industry Silicon Wafer Cleaning With Good Degreasing Performance

The RCA clean process is based on a cleaning method developed at RCA Corporation to remove organic residue from silicon wafers. The cleaning solution is made up of 5 parts water, 1 part 27% ammonium hydroxide and 1 part 30% hydrogen peroxide. It removes organic contaminants and leaves a thin layer of oxidized silicon on the surface of the wafer.

Silicon Wafer Cleaning feature

1) single group products with perfect PPR(performance price ratio)

2) be free from calcium, magnesium, metal, copper, lead and phosphor, and meet the requirement of ROHS.

3)good degreasing performance to meet the requirement of high-accuracy IT area.

Silicon Wafer Cleaning technical parameter

Silicon Wafer Cleaning instructions

1) put pure water into cleaning tank till three-quarter, then, add agent in 3% -5% concentration, add water till working level, last, heat the bath solution till working temperature.

2) need to change bath solution completely after degreasing certain amount silicon slice.

3) reduce exposed time in air to avoid oxidation.

4) working temperature 50-65 degree, disposal time: 2-5minutes.

Silicon Slice Detergent

Industrial Chemical Cleaning

IT Industry Silicon Wafer Cleaning With Good Degreasing Performance Images